Rudolph Delivers New Metal Film Metrology Capability to Mobile Display Market

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process
characterization equipment and software for microelectronic manufacturers,
announced today that it has sold the first of its new MetaPULSE FP thin film
metrology systems to a major manufacturer of flat panel displays (FPD) for
handheld mobile devices, such as tablets, electronic book "e-readers" and
smart phones. The system uses Rudolph's proprietary PULSE Technology to
measure the critical thickness of metal layers deposited during the
manufacturing process, providing the precise process control needed to
enhance process yields and product quality.

"The MetaPULSE FP system is a unique solution that allows for measurement of
critical metal film thicknesses on actual product structures without contacting
or destroying the device," said Dr. Avishai Kepten, vice president and general
manager of Rudolph’s Metrology Business Unit. "The first tool is being qualified
on an R&D line, and we believe the capability will be indispensable as our
customer ramps to high-volume production."

Picosecond Ultrasonic Laser Sonar (PULSE) technology’s unique ability to provide
non-contact, non-destructive, on-product measurements of single and multi-
layered opaque thin films has allowed Rudolph to establish a market-leading
position for FEOL (front-end-of-line) and BEOL (back-end-of-line) processes in
semiconductor manufacturing. In the past year, Rudolph’s Metrology Business
Unit has worked with major manufacturers and process tool providers from the
FPD and LED (light emitting diode) markets to develop PULSE-based solutions
suited to the specific needs of these unique markets.

Rudolph’s director of metrology product management, Tim Kryman, said, "For
many years MetaPULSE technology has been the ideal solution for measuring
the thickness and other properties of thin metal films in semiconductor
manufacturing applications. The new FP system combines a MetaPULSE
measurement head with customized glass substrate handling to extend this
critical measurement capability to the much larger substrates used to make flat
panels. This MetaPULSE FP tool was delivered and installed in the second
quarter and is being used for measurements on 4.5 generation substrates
(790mm by 930mm), which are used to make displays for e-readers, tablets,
phones and other mobile devices. We are also in discussions with
manufacturers of much larger panels used for television displays."

Today, most large FPD manufacturers use an active matrix technology that
involves fabricating the thin-film transistors (TFT) in either amorphous or
polycrystalline silicon applied to the rear of the glass, which is very similar to
those used during semiconductor manufacturing. A typical TFT process
includes the deposition of a series of gate metals such as Cr, Ta, Al, Mo, Ta, as
well as deposition of Ti and/or Al source and data lines. Application studies for
traditional and advanced FPD manufacturing processes have proven that PULSE
is the only technology that can provide non-contact, non-destructive
measurements of these metals, individually or in a multi-layered film stack,
with gauge capability.

Process control of these layers is directly related to panel performance and
process yield. With the development of the first MetaPULSE FP system, Rudolph
engineers have successfully separated measurement and substrate handling
functions.

"Ongoing development activity is focused on repackaging the PULSE
measurement head with larger substrate handling to accommodate the full
range of FPD sizes currently in production. Our goal is to provide this critical
metal metrology for all generations of FPD manufacturing," added Kepten.

Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, process control metrology, and
data analysis systems and software used by semiconductor device
manufacturers worldwide. Rudolph provides a full-fab solution through its
families of proprietary products that provide critical yield-enhancing
information, enabling microelectronic device manufacturers to drive down the
costs and time to market of their products. The company’s yield management
solutions are used in both the wafer processing and final manufacturing of ICs,
as well as in emerging markets such as FPD, LED and Solar. Headquartered in
Flanders, New Jersey, Rudolph supports its customers with a worldwide sales
and service organization. Additional information can be found on the
company’s web site at www.rudolphtech.com.