International Conference on Condition Monitoring and Asset Management Call for Papers
Posted: 2019-1-14
The Sixteenth International Conference on Condition Monitoring and Asset Management (CM 2019) will take place from Tuesday 25 to Thursday 27 June 2019 at The Principal Grand Central Hotel, Glasgow, UK. The conference is organised by the British Institute of Non-Destructive Testing (BINDT) in close partnership with the International Society for Condition Monitoring (ISCM) and the US Society for Machinery Failure Prevention Technology (MFPT).
Following feedback received after the deadline for abstract submissions for this year’s conference closed, the decision has been taken to extend the deadline to Friday 25 January 2019.
Papers are invited on all aspects of CM including:
Applications
Architecture of CM systems
Asset management
Certification, education and training in CM
CM for biomedical and healthcare applications
CM case studies
CM for civil engineering
CM for manufacturing
CM systems and applications
CM and diagnosis methods and technologies
Cost-benefit analysis
Damage
Data mining and fusion
Decision support for CM
Design and lifecycle integrity
Design for CM and maintenance
Engineering standards in CM
Equipment troubleshooting
Failure assessment and failure consequences
FMEA and FMECA
Future directions for CM
Instrumentation for CM
Integrated vehicle health management (IVHM)
IT in CM
Machinery failure analysis and prevention
Maintenance
Maintenance planning, scheduling and control
Materials and structural health monitoring
Modelling and signal processing for CM
NDT
Optimisation in CM
Pattern recognition for CM
Physics of failure, fault/failure modes
Prognostics
Repair and overhaul
Risk assessment
Root cause analysis
Sensors and actuators
Through-life support
Wireless CM
Other relevant topics are welcome.
To submit an abstract (of no more than 200 words) visit: https://mc.manuscriptcentral.com/cm2019-mfpt2019 or via the link on the conference website at: www.cm-mfpt.org by Friday 25 January 2019.
All abstracts and papers will be subject to peer review by members of the International Scientific Advisory Committee. All approved papers will appear in the conference proceedings. Selected papers may be published in the BINDT international journal Insight, the International Journal of Condition Monitoring or other leading international journals. Papers related to ‘case studies’ may be published in BINDT’s newsletters, Condition Monitor and NDT News.
The CM 2019 conference will provide attendees with a unique opportunity to make connections with academics and industrialists from all over the world and benefit from in-depth networking with peers. Leading figures in the field of condition monitoring will be presenting at the conference, with the very latest developments in the fields of CM and asset management being revealed, ensuring all attendees will learn something.
Call for Travel and Attendance Award applicants
If you are based overseas and from the profession of NDT and CM, but are unable to attend due to financial constraints, you may be eligible for the BINDT Travel and Attendance Award. Applicants can range from individuals at an early career stage or be experienced contributors. To view the eligibility criteria and details on how to apply, visit: http://www.bindt.org/events/CM2019/travel-and-attendance-award/.
Follow this event on Twitter @CM_MFPT
About BINDT
The British Institute of Non-Destructive Testing (BINDT) is a UK-based professional engineering institution working to promote the advancement of the science and practice of non-destructive testing (NDT), condition monitoring (CM), diagnostic engineering and all other materials and quality testing disciplines. Internationally recognised, it is concerned with the education, training and certification of its members and all those engaged in NDT and CM and through its publications and annual conferences and events it disseminates news of the latest advances in the science and practice of the subjects. For further information about the Institute and its activities, visit http://www.bindt.org
What are NDT and CM?
Non-destructive testing is the branch of engineering concerned with all methods of detecting and evaluating flaws in materials. Flaws can affect the serviceability of a material or structure, so NDT is important in guaranteeing safe operation as well as in quality control and assessing plant life. The flaws may be cracks or inclusions in welds and castings or variations in structural properties, which can lead to a loss of strength or failure in service. The essential feature of NDT is that the test process itself produces no deleterious effects on the material or structure under test. The subject of NDT has no clearly defined boundaries; it ranges from simple techniques such as the visual examination of surfaces, through the well-established methods of radiography, ultrasonic testing and magnetic particle crack detection, to new and very specialised methods such as the measurement of Barkhausen noise and positron annihilation spectroscopy.
Condition monitoring (CM) aims to ensure plant efficiency, productivity and reliability by monitoring and analysing the wear of operating machinery and components to provide an early warning of impending failure, thereby reducing costly plant shutdown. Condition monitoring originally used mainly vibration and tribology analysis techniques but now encompasses new fields such as thermal imaging, acoustic emission and other non-destructive techniques. The diagnostic and prognostic elements, in addition to increasingly sophisticated signal processing, is using trends from repeated measurements in time intervals of days and weeks.
Following feedback received after the deadline for abstract submissions for this year’s conference closed, the decision has been taken to extend the deadline to Friday 25 January 2019.
Papers are invited on all aspects of CM including:
Applications
Architecture of CM systems
Asset management
Certification, education and training in CM
CM for biomedical and healthcare applications
CM case studies
CM for civil engineering
CM for manufacturing
CM systems and applications
CM and diagnosis methods and technologies
Cost-benefit analysis
Damage
Data mining and fusion
Decision support for CM
Design and lifecycle integrity
Design for CM and maintenance
Engineering standards in CM
Equipment troubleshooting
Failure assessment and failure consequences
FMEA and FMECA
Future directions for CM
Instrumentation for CM
Integrated vehicle health management (IVHM)
IT in CM
Machinery failure analysis and prevention
Maintenance
Maintenance planning, scheduling and control
Materials and structural health monitoring
Modelling and signal processing for CM
NDT
Optimisation in CM
Pattern recognition for CM
Physics of failure, fault/failure modes
Prognostics
Repair and overhaul
Risk assessment
Root cause analysis
Sensors and actuators
Through-life support
Wireless CM
Other relevant topics are welcome.
To submit an abstract (of no more than 200 words) visit: https://mc.manuscriptcentral.com/cm2019-mfpt2019 or via the link on the conference website at: www.cm-mfpt.org by Friday 25 January 2019.
All abstracts and papers will be subject to peer review by members of the International Scientific Advisory Committee. All approved papers will appear in the conference proceedings. Selected papers may be published in the BINDT international journal Insight, the International Journal of Condition Monitoring or other leading international journals. Papers related to ‘case studies’ may be published in BINDT’s newsletters, Condition Monitor and NDT News.
The CM 2019 conference will provide attendees with a unique opportunity to make connections with academics and industrialists from all over the world and benefit from in-depth networking with peers. Leading figures in the field of condition monitoring will be presenting at the conference, with the very latest developments in the fields of CM and asset management being revealed, ensuring all attendees will learn something.
Call for Travel and Attendance Award applicants
If you are based overseas and from the profession of NDT and CM, but are unable to attend due to financial constraints, you may be eligible for the BINDT Travel and Attendance Award. Applicants can range from individuals at an early career stage or be experienced contributors. To view the eligibility criteria and details on how to apply, visit: http://www.bindt.org/events/CM2019/travel-and-attendance-award/.
Follow this event on Twitter @CM_MFPT
About BINDT
The British Institute of Non-Destructive Testing (BINDT) is a UK-based professional engineering institution working to promote the advancement of the science and practice of non-destructive testing (NDT), condition monitoring (CM), diagnostic engineering and all other materials and quality testing disciplines. Internationally recognised, it is concerned with the education, training and certification of its members and all those engaged in NDT and CM and through its publications and annual conferences and events it disseminates news of the latest advances in the science and practice of the subjects. For further information about the Institute and its activities, visit http://www.bindt.org
What are NDT and CM?
Non-destructive testing is the branch of engineering concerned with all methods of detecting and evaluating flaws in materials. Flaws can affect the serviceability of a material or structure, so NDT is important in guaranteeing safe operation as well as in quality control and assessing plant life. The flaws may be cracks or inclusions in welds and castings or variations in structural properties, which can lead to a loss of strength or failure in service. The essential feature of NDT is that the test process itself produces no deleterious effects on the material or structure under test. The subject of NDT has no clearly defined boundaries; it ranges from simple techniques such as the visual examination of surfaces, through the well-established methods of radiography, ultrasonic testing and magnetic particle crack detection, to new and very specialised methods such as the measurement of Barkhausen noise and positron annihilation spectroscopy.
Condition monitoring (CM) aims to ensure plant efficiency, productivity and reliability by monitoring and analysing the wear of operating machinery and components to provide an early warning of impending failure, thereby reducing costly plant shutdown. Condition monitoring originally used mainly vibration and tribology analysis techniques but now encompasses new fields such as thermal imaging, acoustic emission and other non-destructive techniques. The diagnostic and prognostic elements, in addition to increasingly sophisticated signal processing, is using trends from repeated measurements in time intervals of days and weeks.
