NDT 2019: Call for Papers
Posted:
The 58th Annual Conference of the British Institute of Non-Destructive Testing (BINDT) will be taking place from 3-5 September 2019 at The International Centre, Telford, UK.

This prestigious event will see experts in non-destructive testing (NDT) and related technologies meet to exchange experiences, ideas and the very latest developments that will shape the future of NDT.

Papers are invited from academia and industry on all aspects of (NDT), including:

Rail and axle testing
Aerospace
Bonded joint inspection
Power generation
Nuclear
NDT of food
NDT in forensic science
Automated and robotic NDT
Theoretical modelling
Inspection qualification
Composites
Adhesives and bonding
Thermography
Ultrasonics
Phased arrays
Electromagnetics
Radiography
Digital radiography
Digital signal processing and imaging
Novel techniques
Monitoring
Research
Time-of-flight diffraction
Technology transfer in NDT
Medical and related NDT
The needs of NDT end-users

Abstracts (of no more than 200 words) must be submitted online at: https://mc.manuscriptcentral.com/ndt2019 by 3 May 2019.

Conference Proceedings will be published in the form of extended abstracts (max 12 pages of A4 text) and one copy will be provided for each delegate. Full written papers that are submitted may be refereed with a view to publication in Insight.

Materials Testing 2019

The 2019 Materials Testing Exhibition (MT2019) will run alongside the NDT conference, with over 70 companies expected to exhibit and promises to be bigger and better than ever.

MT2019 is free of charge for visitors, who will benefit not only from a concentration of materials testing innovation and excellence, but also from an enhanced programme of talks and seminars in the exhibition hall, covering practical aspects of NDT and related technologies.

Travel award

The aim of this award is to encourage attendance at the BINDT annual conferences by contributors from foreign nations. The target group for this award is individuals from the profession of NDT who wish to attend the conferences by are unable to do so due to financial constraints. Applicants can range from individuals at an early career stage or be experienced contributors who are unable to attend because of restricted finance.

The award consists of a contribution towards travel, subsistence and conference fees. The amount will be typically up to 750 and a free full-time conference registration. The award will be paid after the conference on the presentation of suitable receipts directly to the conferences and events department.

To view the eligibility criteria and details on how to apply, click here.

Contact: Karen Cambridge
Conferences and Events Department, BINDT, Midsummer House, Riverside Way, Bedford Road, Northampton NN1 5NX, UK. Tel: +44 (0)1604 438300; Fax: +44 (0)1604 438301; Email: conf@bindt.org

About BINDT

The British Institute of Non-Destructive Testing (BINDT) is a UK-based professional engineering institution working to promote the advancement of the science and practice of non-destructive testing (NDT), condition monitoring (CM), diagnostic engineering and all other materials and quality testing disciplines. Internationally recognised, it is concerned with the education, training and certification of its members and all those engaged in NDT and CM and through its publications and annual conferences and events it disseminates news of the latest advances in the science and practice of the subjects. For further information about the Institute and its activities, visit http://www.bindt.org