SHANGHAI, March 20, 2026 /PRNewswire/ -- Raytron Microelectronics, a subsidiary of Raytron Technology Co., Ltd. and a leader in infrared thermal imaging, today announced the launch of three new thermal imaging modules -- WN2T, DVS256, and the ECOT series -- at MWC Barcelona 2026.
Under the theme "See Heat. Anywhere.", Raytron Microelectronics showcases how compact, high-performance thermal modules are enabling broader adoption of infrared technology in outdoor night vision, search and rescue, smart cities, industrial inspection, and intelligent manufacturing.
Unlocking Real-Time Temperature Monitoring with the WN2T Thermal Module
The WN2T, the latest addition to the WN2 series, is designed for high-precision temperature measurement. Available in multiple resolution options ranging from 256×192 to 640×512, the WN2T integrates a proprietary 12 µm high-frame-rate infrared detector with its second-generation infrared ISP for stable and high-clarity imaging.
Compared with the WN2 thermal imaging module, the WN2T introduces a real-time temperature display function, enabling accurate temperature data directly on thermal images.
This makes it ideal for:
What Thermal Imaging Modules Are Best for Consumer Electronics Integration?
Designed for the consumer market, the DVS256 combines infrared and visible light imaging to deliver enhanced visual images.
The ECOT series is a 160×120 LWIR module designed for space-constrained environments.
The newly-launched thermal modules highlight Raytron Microelectronics' continuous innovation in high-performance, miniaturized infrared thermal imaging products.
They also accelerate the expansion of thermal sensing from traditional industrial applications into a broader ecosystem of smart devices and consumer electronics.
About Raytron Microelectronics
With full-stack capabilities from IC and MEMS sensor design to system integration, Raytron Microelectronics delivers high-performance infrared solutions for:
The company provides OEMs with advanced thermal imaging modules and detectors to enable seamless integration of infrared capabilities into smart devices.
For Further Information