SensorScan for Sensor Networks Inc
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Scan3D Phased Array Immersion Scanner
Company: TecScan
Address1: 75 De Mortagne Blvd.
Address2: Suite 122
City: Boucherville
State: QC
Country: Canada
TecScan is proud to introduce Scan3D™, a family of High Precision
Scanners. Combined with TecView3D and our Gimbal/Gimbal, Scan3D
revolutionizes the ultrasonic scanning process. With Scan3D, the scan-
plans of the parts are directly imported from the CAD files and C- Scans are
performed simultaneously in Through-Transmission and Pulse-Echo. Results
are then displayed on the imported 3D model for analysis.

Scan3D allows you to perform advanced contour following with arbitrary
motion and following the shape of any curved part. The capabilities of this
Immersion Scanner are numerous; users can combine the automated teach and
learn with the imported 3D CAD of the part to generate scan-plans and perform
complex 3D contour following.
TecViewTM3D is at the heart of Scan3D immersion scanner solution. With its added capabilities in term of complex 3D motion control, interactive inspection plan- ning and variety of analysis tools, the Scan3D has un matched scanning features. Complex ultrasonic inspec- tions can be performed quickly and easily. For part im- port, normalized 3D step file format is used. Once CAD geometry is imported, Scan3D associates the part surfaces to the appropriate scanner axes and creates a parametric space that defines the surface. TecView3D also provides Sound Path Calculation capabilities. This module is very useful when combined with teach and learn process. It can calcu- late the entry and exit points of the ultrasonic waves and ensure an optimal sound transmission and reception. TecView3D also allows live data analysis creating C-Scans as soon as the first A-Scans appears on the screen. We could define up to 16 gates to op- timize data analysis by performing amplitude, time-of-flight and thickness based C-Scan imaging simultaneously. Plus, material interface gate type can be used to identify and define different material layers, allowing for depth or thick- ness measurements to be done on each existing material layer.